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型號(hào)： W6TR315G-3.0

類別： 集成電路

描述： The W6TR315G-3.0 is a 3mm Thermally Conductive Filler Pad extremely offers soft, 20 shore 00, yet maintains a high thermal conductivity of 3.15W/mK. It is the ideal material in situations where a great deal of heat needs to be conducted away from small electronic components. The extremely soft material allows it to adapt to different component shapes. Also the material offers low heat resistance, this particular property is reduced as the product"s thickness is decreased. As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management. Thermasol markets a variety of thermal management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc. . 2.11g/cm3 Specific gravity . <1% Weight loss . 21.66psi Tensile strength . 410.38% Elongation . 1kV/mm Insulation strength . UL94V-0 Flammability rating . -40 to 200°C Operating temperature

品牌官網(wǎng)： www.amecthermasol.co.uk