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型號(hào)： 638135

類別： 集成電路

描述： The 638135 is a RMA Liquid flux with a proprietary formulation that combines superior mobility and spread with faster initial wetting action. It is more effective and will maintain operating activity longer than conventional RMA type fluxes. It can be reliably and used where the solderability of an assembly needs an active flux formulation approaching an RA type but specifications mandate an RMA flux. As a result, it is ideal for use with multilayer, surface mount, densely populated and complex boards. Solder spread is up to 50% greater than conventional RMA fluxes assuring excellent penetration of plated through hole. It is ideal for single and double-sided PTH boards as well as multilayer and bottom-side SMD applications. . Results in faster throughput, fewer defects and less touch-up . Eliminates solder build-up . Flux residues are easily removed where required

品牌官網(wǎng)： www.henkel-adhesives.com