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型號： 81012UK2T195KT1

品牌： POWER ADHESIVES

類別： 集成電路

描述： The 81012UK2T195KT1 is a Potting and Encapsulation System with heavy-duty metal box. The Tecbond 7718 power adhesive has developed a new manufacturing process for a black polyamide potting compound that can be dispensed through conventional 12mm hot-melt glue guns. This process has been specifically designed to satisfy the requirements that demanding potting, encapsulating and casting applications need in the electronic. The TEC 810-12 brings a new level of performance and reliability to the mild range industrial glue gun section of the market. The TEC 810-12 has been designed for continuous industrial use. Built-in the UK to the highest standard with that goal of having the highest performing glue gun in its class. . Fast setting time of between 5 seconds and 2 minutes . No need for ovens to accelerate the curing process . No mixing and no waste . No consumable parts . No cleaning or flushing required . Long shelf life . No messy residue

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