TSPC860SRMZQU66D
型號: TSPC860SRMZQU66D
類別: 嵌入式處理器
描述: MPU PowerQUICC Processor RISC 32bit 66MHz 3.3V 357-Pin BGA
品牌官網(wǎng): www.teledyne-e2v.com
- 賣盤信息
- 常見問題
- 參數(shù)
-
平臺購物流程是怎樣的?
平臺商品來源有保障嗎?
平臺上展示的商品數(shù)量、價格及相關(guān)信息準確嗎?
平臺支持BOM詢價嗎?
平臺下單后什么時候能發(fā)貨?多久能到?
拍明芯城的訂單如何跟蹤?
拍明芯城的訂單可以提供合同嗎?
拍明芯城的發(fā)票如何開具?
參數(shù) | 數(shù)值 |
---|---|
EU RoHS
|
Not Compliant
|
ECCN (US)
|
3A001.a.2.c
|
Part Status
|
LTB
|
HTS
|
8542.31.00.01
|
Family Name
|
PowerQUICC Processor
|
Instruction Set Architecture
|
RISC
|
Device Core
|
PowerQUICC
|
Number of CPU Cores
|
1
|
Data Bus Width (bit)
|
32
|
Maximum Speed (MHz)
|
66
|
UART
|
0
|
USART
|
0
|
Multiply Accumulate
|
No
|
SPI
|
0
|
I2C
|
0
|
I2S
|
0
|
CAN
|
0
|
Ethernet
|
0
|
Minimum Operating Supply Volta...
|
3.135|2
|
Typical Operating Supply Volta...
|
2.5|3.3
|
Maximum Operating Supply Volta...
|
3.465|3.6
|
I/O Voltage (V)
|
3.3
|
Maximum Power Dissipation (mW)
|
762
|
Minimum Operating Temperature ...
|
-55
|
Maximum Operating Temperature ...
|
125
|
Standard Package Name
|
BGA
|
Pin Count
|
357
|
Supplier Package
|
BGA
|
Mounting
|
Surface Mount
|
Package Height
|
1.82(Max)
|
Package Length
|
25
|
Package Width
|
25
|
PCB changed
|
357
|
Lead Shape
|
Ball
|